Title:
EPOXY RESIN MOLDING MATERIAL, MOLDED PRODUCT, MOLDED CURED PRODUCT, AND METHOD FOR PRODUCING MOLDED CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2017/145411
Kind Code:
A1
Abstract:
Provided are: an epoxy resin molding material that contains an epoxy resin, which has a mesogen skeleton, a phenolic curing agent, an inorganic filling material, and a curing accelerator, which has a quaternary phosphonium cation represented by general formula (I); a molded product and molded cured product that use said epoxy resin molding material; and a method for producing a molded cured product. In general formula (I), Ra-Rd each independently represent a C1-6 alkyl group or aryl group, and said alkyl group and aryl group may have a substituent group.
Inventors:
TANAKA KENJI (JP)
YOSHIDA YUKA (JP)
KOSUGI SHINICHI (JP)
TANAKA SHINGO (JP)
KATAGI HIDEYUKI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
YOSHIDA YUKA (JP)
KOSUGI SHINICHI (JP)
TANAKA SHINGO (JP)
KATAGI HIDEYUKI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2016/074880
Publication Date:
August 31, 2017
Filing Date:
August 25, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/22; C08G59/62
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 |
Foreign References:
| JP2013234313A | 2013-11-21 | |||
| JP2004010762A | 2004-01-15 | |||
| JP2004161909A | 2004-06-10 | |||
| JP2002226550A | 2002-08-14 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: