Title:
EPOXY RESIN COMPOSITION, SEMI-CURED EPOXY RESIN COMPOSITION, CURED EPOXY RESIN COMPOSITION, MOLDED OBJECT, AND CURED MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2017/145410
Kind Code:
A1
Abstract:
An epoxy resin composition which comprises an epoxy resin and a hardener, wherein the epoxy resin comprises one or more polymer compounds each having at least one structural unit selected from the group consisting of structural units represented by general formula (IA) and structural units represented by general formula (IB), the polymer compounds including a dimer compound having, in the molecule, two structural units represented by general formula (II), the dimer compound accounting for 15-28 mass% of the whole epoxy resin.
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Inventors:
YOSHIDA YUKA (JP)
TANAKA KENJI (JP)
KATAGI HIDEYUKI (JP)
AMANO YOSHIHIRO (JP)
KOSUZI SHINICHI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
TANAKA KENJI (JP)
KATAGI HIDEYUKI (JP)
AMANO YOSHIHIRO (JP)
KOSUZI SHINICHI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2016/074879
Publication Date:
August 31, 2017
Filing Date:
August 25, 2016
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08G59/24; C08K3/22; C08K3/28; C08K3/36; C08K5/54; C08L61/04; C08L63/00
Domestic Patent References:
| WO2002094905A1 | 2002-11-28 |
Foreign References:
| JP2013234313A | 2013-11-21 | |||
| JP2013227451A | 2013-11-07 | |||
| JP2004010762A | 2004-01-15 | |||
| JP2004161909A | 2004-06-10 | |||
| JP2002226550A | 2002-08-14 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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