Technical field

The present invention relates to engineering in particular the equipment and processes for temperature stabilization.

Background

The Joule Thomson (J-T) effect is the air reduced volume at room temperature, the enthalpy or beat capacity is reduced. The reduced air volume is inversely proportional to the pressure. This causes the pressure of compressed air to increase and flow through the valve with a small and narrow channel That cause the temperature reduced and the enthalpy decreases. The Joule Thomson (J-T) effect is an adiabatic process, which is the process ofchanging tire system without die heat transfer of the system to the environment. Therefore, it is an irreversible process.

Currently, the Joule Thomson phenomenon has been applied to air conditioners, heater and liquefaction of gas, such as air conditioning. That can be described as follows. The compressor will absorb the heat in the room then increase the pressure and temperature of the refrigerant and send refrigerant to the evaporator The evaporator uses a fan to blow the temperature down at constant air pressure. It will then be forwarded to a pressure reducing device (Throttling device) which looks like a valve with a small and narrow channel. And the temperature is lower as well. Refrigerant flow through the throttling device and flow into the evaporator coil and then come back to suck the heat in the room again and send into the compressor to continue circulating.

The problem of the Joule Thomson (J-T) effect is an irreversible process. The refrigerant will be released into the atmosphere. In addition, many types of refrigerants destroy the atmosphere, such as carrofluorocarbons. (Chlorofluorocarbon or CFC) in the category CFC-11, CFC-12, CC-114, etc. Currently, the amendment is to choose non-hazardous or less harmful substances and can be reused to reduce consumption but still destroys the atmosphere as before.

I he Peltier effect is the transformation of an electric current and change temperature by passing an electric current through two different types of conductive materials. The electrons in both materials have unequal energy values. Therefore, the free electron movement occurs, where electrons from materials with lower energy values move to electrons with higher energy values. in movement, energy will be absorbed to travel to new energy values and absorb heat from the environment. That cause the temperature in the area to drop. And when electrons are induced by electric potential, the electrons move from the higher energy region to the lower energy region. The electrons release energy in the form of heat and raise the temperature The Seebeck effect is the conduction of temperature differences to generate electricity.

This is a reverse phenomenon of the Peltier effect by bringing two different types of conductor metals. Then the effect heats the connection points on each side. The electrons in a hotter region have higher energy values and move faster. That cause a difference in the amount, of electrons electric current. Publication US20192057556 A 1 , USA from LES ENTERPRl SE ZERONEXT CORP and

Danby Product Ltd. reveal the wall-mounted refrigeration system with Peltier effect by inventing the Peltier shape that maintains the cooling temperature longer and develop a new beat circulation system. The patent focuses solely on thermoregulation with the Peltier effect.

Publication CN i 05556415 B, People's Republic of China by QUALCOMM INC. reveals the .surface heat measurement of cordless telephone equipment and computer tools or equipment by using the Peltier effect and the Seebeck effect. The Peltier is installed on the inside and outside of the surface. Adopt the temperature difference principle, generate electricity and store in the battery. The patent is a development of two phenomena in the communications and computer industries, but not optimization or to better solve the Peltier effect and the Seebeck effect.

The Peltier effect have a problem of industrial use, namely the inability to maintain a constant temperature and unable to reduce the temperature to below 4 degrees Celsius. That, cause limitations in use The Peltier effect has been found in use in the computer industry. It is used to coo! the CPU. But now there are more hardware developments. The heat in the CPU is reduced. Them is also a problem of using a lot of electricity and waste of energy. That cause the Peltier effect to stop developing in this industry

The Seebeck effect has a problem with industrial applications, where the use of two different metals results in less electricity generation. Although changing the type of metal to a semiconductor that still produces less electricity as before. M cannot be used in practice on an industrial scale. The solution currently focuses on finding the right materials to generate electricity. Summary of Invention

According to the present invention there is provided the temperature stabilization equipment and processes such that consists of two sub-processes: the cooling process and the exothermic process. It is the interaction of the Peltier effect and the Seebeck effect and creates an isothermal process to maintain a constant temperature and generate internal electricity.

Brief description of the drawings

An embodiment, incorporating all aspects of the invention, will now be described by way of example only with reference to the accompanying drawing in which,

Figure 1 is diagram of the process for temperature stabilization.

Figure 2 is diagram of the process of the equipment

Detailed description

The following will be revealed equipment and processes for temperature stabilization comprises; the cooling process and the decreasing heat process.

The cooling process consists of at least one closed path through the following internal components: an evaporator (2), a cold tank (3), and a cooling plate that connect by a closed path.

Ihe decreasing heat process consists of at least- one closed path through the following internal components: a condenser ( 8), a coolant tank (9), and a heal plate feat connect by a closed path

And the temperature control plate (14) serves to control the temperature such that a temperature control plate is a semiconductor with higher energy value than cold plate and heat plate. fhe temperature stabilization process is described in Figure 1 as follows: first Inject current into a device cooling fen (1), a heating fen (7) and a thermoelectric cell (13) then the temperature stabilization process is divided into 2 of the digestion process. Working simultaneously, including the cooling process and heat transfer process.

The cooling process comprises the refrigerant, an evaporator fan (1), an evaporator (2), a cold tank (3), a pump (4), a cooling plate (5), a heating plate (12) and a thermoelectric cell (13) describe the process as follows. The fen of the evaporator fan (1) will absorb external heat into the evaporator (2) that contains the refrigerant. The heat that is sucked in and raise the refrigerant temperature. The refrigerant flows into a cold tank (3) and then continues to a pump (4). which increases the refrigerant's movement speed and flow through a cooling plate (5), When the refrigerant moves into a cooling plate (5), the refrigerant temperature will remain high initially. And because a cooling plate (5) has lower energy value than a heat plate (12). The tree electrons occur. That cause the heat from the traveling refrigerant to be absorbed then lower the temperature of the refrigerant and flow to an evaporator (2).

Cause of electron travel, a cooling plate (5) is welded to a thermoelectric cell (13) that, controls the flow of electrons. The electrons from a cooling plate (5) travel to a heat plate (12) that is bonded to the other side of a thermoelectric cell (13) because a heating plate (12) has higher energy properties, and a thermoelectric cell (1.3) receives electricity from the start of the process thus causing the Peltier effect

The decreasing heat process comprises a coolant, a cooling plate (5), a manifold 1 (6), a heating fan (7), a condenser (8), a coolant storage tank (9), the pump (10), a manifold 2 (11), a heating plate (12) and a thermoelectric cell (13) describe the process as follows. The coolant storage tank (9) serves to store coolant. The coolant moves from the coolant reservoir (9) through the pump (10) to speed up its movement The coolant moves to manifold 2 (11) and then continues to the heat plate (12). Since the heat plate (12) has higher energy efficiency than the cooling plate (3). The electrons go towards the lower energy side and heat, Therefore, the temperature of the coolant increases. The heated coolant will move to manifold 1 (6) and then continue to the condenser (8), which serves to reduce the temperature from the coolant and cool it. It is discharged with the cooling Ian (7), then the coolant with reduced temperature moves ^' to the coolant storage tank (9).

Because of the coolant enter the heat plate (12) with high temperature, and the heat plate (12) is welded to the thermoelectric cell (13). The ending of thermoelectric cell (13) will be welded to the cooling plate (5), which has a lower temperature. The Seebeck effect to cause an electric current thermoelectric cell (13).

Because the thermoelectric ceil (13) is bonded to the cooling plate (5) and the heat plate (12) and receives electricity from the previous Seebeck effect, it makes the Peltier effect repeatedly. The electrons of the heat plate (12) to move to a lower energy. As a result, the exothermic effect causes the temperature of the hot plate (12) to rise, and the electrons of the cold plate (5) go to the higher energy area. Therefore, the heat of the refrigerant is absorbed at the cooling plate (5), causing the temperature of the cooling plate (5) to decrease. That cause the temperature of the cooling plate (5) and heat plate (12) inverse variation with respect to time.

Therefore, it is the process for temperature stabilization by keeping the temperature of the cooling plate (5) to decrease steadily and the temperature of the heat plate (!2) increases steadily.

From Figure 2, the process of equipment is described as follows; a cooling fan (1), a heat tan (?), and a group of thermoelectric ce!is whereinto; group of the thermoelectric cel l Including the thermoelectric cell (130), the thermoelectric cell (131), the thermoelectric cell (132), the thermoelectric cell (133), the thermoelectric cell (134) and the thermoelectric cell (135),

Then the temperature stabilization process is divided into 2 sub-processes working simultaneously, namely the cooling process, and the decreasing heat process.

The cooling process comprises the refrigerant, a cooling fan (1), a cooling fan (2), a coolant storage tank (3), a pump (4), the group of cooling plates, the group of heating plate , thermoelectric cell, temperature control plate (14), air filter (15), liquid tray (16) and liquid storage tank (l / l.

The group of cooling plates are cooling plates (50), cooling plates (51), cooling plates

(53). The group of heat piates are heat plates (120), heat plates (121) and heat plates (122).

The process is described as follows. The fan of the cooling fan (1) serves to absorb external heat. And air will move through an air filter (15) that filters dust into the evaporator (2) that contains the refrigerant. The heat is sucked in and raise the refrigerant temperature. The refrigerant travels into the coolant storage tank (3) and then flow to the pump (4), which increases the refrigerant's movement speed and control the amount of refrigerant and then move to the cooling plate (50). When the refrigerant moves into the cooling plate (50), the temperature of the refrigerant will remain high initially. And because the cooling plate (50) has lower energy value than the heat plate (120) and heat plate (121), free electrons travel at the thermoelectric cell (130) and the thermoelectric cell (131) at the same time. This causes the absorption of heat from the traveling refrigerant that lower the temperature of the refrigerant. The refrigerant then moves to the cooling plate (51), and since the cooling plate (51) has lower energy values than the heat plate (.121) and heat plate (122). This causes the independent travel of free electrons at the thermoelectric cell (132) and the thermoelectric cell (133) at the same time. This results in the absorption of heat tforn the traveling refrigerant. This cause the refrigerant temperature to he lower than the refrigerant temperature at the cooling plate (50). The refrigerant then moves to the cooling plate (53). And because the cooling plate (53) has lower energy value than the heat plate (121) and heat plate (122). This causes the free electrons travel at the thermoelectric cel! (134) and the thermoelectric cell (135) at the same time. This causes the heat to be absorbed from the traveling refrigerant, causing the refrigerant temperature to be lower than the refrigerant temperature at the cooling plate (51). The refrigerant then moves back into the evaporator (2) and continue to absorb heat. And because a group of cooling plates has more than one cooling plate, it can cause liquid waste. Including condensation may be condensed into liquid droplets. The pari of the liquid then flows to the liquid tray (16), and then flow to the liquid storage tank (!?).

The electrons path in the cooling process formed by each thermoelectric cell is connected to the heating plate. As shown in Table 1 as follows:

Table 1 : Shows the bonds between the thermoelectric cell and heating plate.

The thermoelectric cell (135) is attached to the temperature control plate (14) to stop the temperature reduction in each cycle.

From Table 1, each thermoelectric cell has one side connected to the heating plate and the other side connected to the cooling plate. Therefore, when an electric current is applied to a group of thermoelectric cells cause the Peltier effect, the independent of movement of electors flow to a group of heat plates. And at the group of cold plates, the temperature is lower. The continuous electric current is obtained, the temperature of the refrigerant at the cooling plate group is gradually lowered. The decreasing heat process comprises; a coolant, a manifold 1 (6), a condenser fan (7), a condenser (8), a coolant storage tank (9), a pump (10.), a manifold 2 (11), a temperature control plate (14), the group of cooling plates, the group of hot plates and the group of thermoelectric cells describe the process as follows, the coolant storage tank (9) serves to store coolant. The coolant moves from the coolant storage tank (9) through the pump (10) to speed up its movement and control the amount of coolant. The coolant moves to manifold 2 (11). The manifold 2 (11) distributes coolant to the group of heat plates. And because the hot plate has a higher energy value than the cold plate. That is a member of the cooling pad group. The relationship is shown in fable 2 as follows:

Table 2: Shows the relationship between hot plate and cold plate.

From fable 2, the inner electrons of the heat plate (120), the heat plate (121) and the heat plate (122) are in motion. The inner electrons of the heat plate (120) move to the cooling plate (50) causing exothermic action. As the coolant temperature at the heat plate (120) increases, the electrons in the heat plate (12.1) move towards the cooling plate (50) and the cooling plate (51) that cause exothermic heat. As the coolant temperature at the heat plate (121) increases, the electrons in the heating plate (122) move towards the cooling plate (51) and the cooling plate (53) that cause exothermic action. The temperature of the coolant, at the heating plate (122) increases. That will move to the manifold 1 (6) and then move on to the condenser (8), which serve to reduce the temperature from the coolant and cool off by the condenser fan (7). Then the coolant with reduced temperature moves to the coolant storage tank (9). Because the coolant entering the group of the heat plate is high temperature and each heating pad is welded to the thermoelectric cell as shown in table 1. The other end of the thermoelectric cell is connected to the cooling plate that is a member of the cooling plate group as shown in table 3 as follows: Table 3: Shows the bonds between the thermoelectric cell and cooling plate as follows

This cause the Seebeck effect that an electric current thermoelectric cell (130), thermoelectric cell (131), thermoelectric cell (132), thermoelectric cell (133), thermoelectric cell (134) and the thermoelectric cell (135). Because the thermoelectric ceil will be welded to the cooling and heat plates by matching as in Tables 1 and 3. They also received electricity from the Seebeck effect that happened earlier. This caused the Peltier effect again. This result is a lower temperature of each cooling plate, and the temperature of each heat plate rises. Therefore, the heat of the refrigerant is absorbed at the cooling plate in the group of all cooling plates. And there is an exothermic effect of the coolant on the heating plates in the group of all heat plates.

The thermoelectric cell (135) is connected to the cooling plate (53) and the temperature control plate (14). The temperature control plate (14) has more energy than the cooling plate (53) that cause free electron travel by the absorption of refrigerant at the cooling plate (53) and exothermic at the temperature control plate (14) as well. The temperature control plate (14) has more energy than the group of cooling plate cooling that cause the generation of electricity through the Seebeck effect and increase the electric current at the thermoelectric cell (135) that cause the Peltier effect in the cooling process. Therefore, the Seebeek effect and the Peltier effect occur continuously;

The Peltier effect continues the temperature at the group of cooling plate is cold ami the temperature at the heat plate bundle is always hot. lire temperature at the temperature control plate (14) is heated at a constant heat. When the temperature is hot or exceeds a preset value, the heat is dissipated by the cooling process by flow to the manifold 1 , the condenser (8) and the condenser fan (7), respectively. When the temperature, is hot or less than the specified constant, heat can be increased in 3 ways: 1 , the condenser fan (7) slow cooling 2. Add a valve to prevent coolant from moving out of the control plate. 3. Increase the speed of coolant movement to the temperature control plate. At least one of these methods is selected, and a combination of all three methods can. he used. This will cause the process of changing the power generation system. The temperature of the temperature control plate (14) is stable in an isothermal process.

Such a process causes a group of thermoelectric cells to produce electricity continuously. As a result, the cooling process is the digestion process continues. As a result, the temperature of the heat absorbing area of the evaporator (2) decreases.

The selection, of refrigerant and coolant is independent of each other. That can choose one type or different type either. Unlike other thermo-systems where only one substance can be obtained. The suitable is a coolant with a boiling point equal to or less than the refrigerant boiling point.

The relationship between the number of cooling plates, heat plates and thermoelectric cell can increase the number in 2 cases as shown below.

Case 1, Group of thermoelectric cell ~ (1, 2, 3, ..., n)

Group of cooling plates (1, 2, 3, ..., n~2)

Group of heat plates :::: (1, 2, 3, .. n-2) where n ::: the integer number.

Case 2, because the temperature control plate (14) has properties as a heat plate and temperature control. Therefore, it is classified as another type of heat plate. According to the Set Theory, it can be said that.

Group of thermoelectric cell ::: (1, 2, 3, ..., n)

Group of cold plates ::: (1 , 2, 3, ..., n-2) Group of hotplates = ( 1 , 2, 3, ... , n-1) where n = the integer number.

Such a relationship will also* cause the temperature stabilization process.

Temperature stabilization equipment are special characteristics as follows.

1. The fan of the evaporator fan (1) absorbs heat and air into the evaporator (2) that has a light feature, easy to clean, small size, can choose the type from bladeless fan. The main components are fan motors and suitable fan motors are 1 -phase induction motors, evaporator fans (1) are made of suitable materials such as plastic and wood. The most suitable material is plastic because of its light weight. They are easy to dean, and the humidity is lower than wood.

2. The condenser fan (7) serves to dissipate heat from the condenser (8) to the outside. Easy to clean and large size can choose the type from bladeless fan that made from suitable materials: plastic and wood. The most suitable material is plastic because it is easy to clean.

3. Evaporator (2) serves to exchange heat from the area that needs to cool or reduce the temperature. Inside looks like a hollow' tube that made of metal coils arranged inside. That has heat transfer properties, thick, not easily broken. The suitable material is copper. The most suitable type of evaporator is made of copper material and the pipe is designed to have a turbulent internal movement because the turbulent movement will help absorb heat faster.

4. The coolant storage tank (3) serves to store refrigerant. It looks strong, durable, corrosion resistant, does not rust, looks like a closed container. There is a lid that opens and closes to fill the refrigerant. And there is a hollow tube that is a connected pipe between the evaporator (2) and the evaporator pump or pump (4). The suitable material is plastic because it has light properties and easy to maintain that increased from the previous proper trait.

6. The pump of the evaporator or the pump (4) serves to add the reduction movement regulating the pressure of the refrigerant and control the amount of refrigerant before entering the cooling plate. The suitable materials are steel, brass, plastic, rubber, carbon steel, stainless steel, gray cast iron. The most suitable material is gray cast iron because it can withstand pressure welt and relatively low temperature.

7. The cooling plate is a metal plate whose energy value is related to the heat plate. It will have less energy than a heat plate. The side of the cooling plate is welded to the thermoelectric cell, where the other side of the thermoelectric cell is connected to a heat plate with high energy value. To create the Seebeck effect and the Peltier effect, die suitable group of materials is conductor material or semiconductor material. The most suitable group of materials is semiconductor material. The suitable semiconductor materials are bismuth tefluride, silicon germanium. Sill eon- germanium, antimony tellaride, manganese oxide and zinc oxide.

8. Manifold 1 (6) serves to collect and distribute the coolant that obtained from the group of heat plates. The condenser (8) has a heat resistant characteristic, externally insulated, corrosion resistant, lightweight. The suitable materials are rubber, plastic, stainless steel. The most suitable material is insulating plastic because of easy procurement, low cost, saving resources, corrosion resistant and light weight.

9. Condenser (8) serves to dissipate heat from the system by .receiving the coolant from the manifold 1 (6), The cooled coolant will move to the storage tank of the coolant (Hot tank) (9). The condenser (8) has the characteristics a hollow tube coiled inside. The hollow tube material is thermally conductive, durable. The suitable materials are aluminum and copper.

10. Coolant storage tank (Hot tank) (9) serves to store refrigerant, it looks strong, durable, corrosion resistant, does not rust, heat resistant, looks like a closed container. There is a lid that opens and closes to fill the coolant. And there is a hollow tube with a connecting pipe between the condenser (8) and the pump of the condenser or pump (10). The suitable materials are stainless steel.

1 1. the heat plate is a metal plate whose energy value is related to the cooling plate. It has a higher energy value than a cooling plate. The side of the heat plate is welded to the thermoelectric cell, where the other side of the thermoelectric cell is connected to the cooling plate with lower energy value. To create the Seebeck effect and the Peltier effect, the suitable group of materials is conductor material semiconductor material The most suitable group of materials is semiconductor material. The suitable semiconductor materials are bismuth telluride, silicon germanium. Silicon-germauuim , antimony te!luride, manganese oxide and zinc oxide.

12. T he pump of the evaporator or pump (10) serves to add the reduction movement coolant pressure regulator control the amount of coolant before going to manifold 2 (11) and through to the heat plate. The suitable materials are steel, brass, plastic, rubber, carbon steel, stainless steel, gray cast iron. The most suitable material is carbon steel, because of its high beat resistance, ifs an easy-to-fmd resource.

13. Manifold 2 (11) is responsible for collecting and distributing coolant from the tank as a coolant (Hot tank) (9) that has a heat-resistant characteristics, externally insulated, corrosion resistant and lightweight The suitable materials are rubber, plastic and stainless steel. The most suitable material Is insulating plastic because of easy procurement low cost, saving resources, corrosion resistant and light weight.

14. Thermoelectric cell is responsible tor changing the temperature difference into electricity and change the electric current to cause the temperature difference on both sides with the principle of vibration of the internal structure of the material. There will be the vibration of the photon and the mo vement of electrons and Hole. The suitable group of materials is semiconductor material.

15. The temperature control plate (14) serves to control and maintain the temperature sufficient to generate electricity. It has properties that provide higher energy values than cold plates (53). That provide higher energy value than the cold plate in the cold plate group. The appropriate group of materials are conductor material semiconductor material. The most suitable group of materials is semiconductor material. The suitable materials are bismuth teliuride, silicon germanium. Silicon-germanuim, antimony telluride, manganese oxide and zinc oxide.

16. The air filter (15) serves to filter dust. That debris from the outside area enters the fan of the Evaporator (1) and Evaporator (2). it is attached in .front of the fan as a grille, made of light material, not rusting and durable. The suitable material is plastic,

1.7. The liquid tray (16) serves to support liquid from the evaporator. That made of lightweight materials that do not rust. The suitable materials are plastic, foam, etc.

18. The liquid storage tank (17) serves to store liquid that flows from the liquid tray (16) looks like a container with a lid. That made of lightweight materials that do not rust. The suitable materials are plastic, foam, etc.

19. Refrigerant acting as a heat, absorber. The suitable .refrigerants include CFC (Chlorofluorocarbon), HFC (Flydrofluorocarbon), HCFC (Hydrochlorolluoroearbon) and HC. (Hydrocarbon). The most suitable refrigerant is HC (Hydrocarbon). 20, Coolant performs a cooling function. The suitable coolants are CFCs (Chlorofluorocarbon),

HFCs (Hydrofluorocarbon), HCFCs (Hydrochlorotluorocarbon) and HCs. (Hydrocarbon), The most suitable coolant is such substances that have a boiling point equal to or less than therefrigerant boiling point.