Title:
ETCHING METHOD FOR MOLDED RESIN ARTICLE AND ETCHING PROCESSING SYSTEM FOR MOLDED RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/074860
Kind Code:
A1
Abstract:
This etching processing system 1 comprises an etching tank 2 in which an etching liquid 3 is received and a heater 4 arranged within the etching tank 2. The etching tank 2 has provided thereto a circulation pipe 5 for forming a flow which exits from the bottom of the etching tank 2 and flows back into the etching tank 2. The circulation pipe 5 is provided with a circulation pump 6, a heat exchanger 7, and an electrolytic cell 8 having an anode electrode 8A and a cathode electrode 8B. In addition, an oxidizing agent concentration meter and a sulfuric acid concentration meter are provided in front of the electrolytic cell 8 of the circulation pipe 5. This etching processing system 1 makes it possible to perform etching of a molded resin body without the use of regulated substances having a heavy impact on health and the environment such as hexavalent chromic acid and permanganic acid and obtain a desired surface state prior to cleaning and modification of the surface of various materials, particularly prior to plating processing of the surface of resin materials.
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Inventors:
ISERI HAJIME (JP)
YAMAKAWA HARUYOSHI (JP)
YAMAMOTO YUZUKI (JP)
YAMAKAWA HARUYOSHI (JP)
YAMAMOTO YUZUKI (JP)
Application Number:
PCT/JP2021/010454
Publication Date:
April 14, 2022
Filing Date:
March 15, 2021
Export Citation:
Assignee:
KURITA WATER IND LTD (JP)
International Classes:
C23C18/24; C09K13/04; C25B1/28; C25B15/08
Foreign References:
| JP2016167560A | 2016-09-15 | |||
| JP2017028101A | 2017-02-02 | |||
| JP2008164504A | 2008-07-17 | |||
| JP2018160517A | 2018-10-11 | |||
| JP2006114880A | 2006-04-27 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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