Title:
ETCHING PROCESSING APPARATUS AND ETCHING PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/177102
Kind Code:
A2
Abstract:
According to an embodiment of the present invention, an etching processing apparatus and an etching processing method using a liquid fluorocarbon or a liquid hydrofluorocarbon precursor may be provided, the etching processing apparatus and etching processing method capable of achieving almost the same effect as cryogenic etching even at a relatively high temperature compared to cryogenic etching. In addition, an etching processing apparatus and an etching processing method capable of solving process problems that may arise due to a liquid precursor and a low temperature may be provided.
Inventors:
KIM KYONG NAM (KR)
YEOM GEUN YOUNG (KR)
KIM DONG WOO (KR)
SUNG DA IN (KR)
TAK HYUN WOO (KR)
OH JI YOUNG (KR)
YEOM GEUN YOUNG (KR)
KIM DONG WOO (KR)
SUNG DA IN (KR)
TAK HYUN WOO (KR)
OH JI YOUNG (KR)
Application Number:
PCT/KR2021/016766
Publication Date:
August 25, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
DAEJEON UNIV INDUSTRY UNIV COOPERATION FOUNDATION (KR)
RESEARCH ＆ BUSINESS FOUNDATION SUNGKYUNKWAN UNIV (KR)
RESEARCH ＆ BUSINESS FOUNDATION SUNGKYUNKWAN UNIV (KR)
International Classes:
H01L21/67
Attorney, Agent or Firm:
PARK, Keon Woo et al. (KR)
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