Title:
EVAPORATOR FOR LOOP HEAT PIPE AND LOOP HEAT PIPE
Document Type and Number:
WIPO Patent Application WO/2022/172546
Kind Code:
A1
Abstract:
This evaporator 100 for a loop heat pipe comprises a flat-plate-like housing 120 which includes a bottom wall 120a, a top wall 120b facing the bottom wall 120a in a thickness direction T, and a side wall 120c that connects, in the thickness direction T, outer edges of the bottom wall 120a and the top wall 120b, wherein: in the housing 120, an internal region surrounded by the bottom wall 120a, the top wall 120b, and the side wall 120c includes a steam chamber 102 which is in contact with an inner surface of the bottom wall 120a; in the side wall 120c, a liquid tube connection port 131 and a steam tube connection port 132 communicating with the steam chamber 102 are provided; and in an outer surface of the bottom wall 120a, a recess part 140 recessed toward the top wall 120b is provided in a region overlapping at least a part of the steam chamber 102 when viewed in the thickness direction T.
Inventors:
YAMADA TATSUYA (JP)
Application Number:
PCT/JP2021/042451
Publication Date:
August 18, 2022
Filing Date:
November 18, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
F28D15/02
Foreign References:
| JP2010078259A | 2010-04-08 | |||
| JP2001177030A | 2001-06-29 | |||
| JP2004311519A | 2004-11-04 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF:
Previous Patent: MOLDED POWER RECEIVING/DISTRIBUTING DEVICE
Next Patent: HEAT-CONDUCTIVE SILICONE COMPOSITION
Next Patent: HEAT-CONDUCTIVE SILICONE COMPOSITION