Title:
MOLDED POWER RECEIVING/DISTRIBUTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172545
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a molded power receiving/distributing device that can be reduced in size and increased in dielectric strength. To achieve this purpose, a molded power receiving/distributing device having a molded insulating layer is provided, the molded power receiving/distributing device comprising: an electrode formed from a metal member; and a second insulating layer provided inside the molded insulating layer and differing from the molded insulating layer. A portion of the second insulating layer is directly or indirectly connected to the metal member, and the second insulating layer extends in the lengthwise direction of the molded power receiving/distributing device.
Inventors:
OOTAKE ATSUSHI (JP)
TAMURA KOZO (JP)
TAMURA KOZO (JP)
Application Number:
PCT/JP2021/042315
Publication Date:
August 18, 2022
Filing Date:
November 17, 2021
Export Citation:
Assignee:
HITACHI INDUSTRY EQUIPMENT SYSTEMS CO LTD (JP)
International Classes:
H01H33/66; H01F30/12; H01F41/12
Foreign References:
| JP2005197128A | 2005-07-21 | |||
| JP2018046264A | 2018-03-22 |
Attorney, Agent or Firm:
SEIRYO I.P.C. (JP)
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