Title:
FABRICATING METHOD FOR COMPONENT EMBEDDED CIRCUIT BOARD, AND COMPONENT EMBEDDED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/105033
Kind Code:
A1
Abstract:
A fabricating method for a component embedded circuit board, and a component embedded circuit board. The fabricating method for a component embedded circuit board comprises the following steps: processing a prefabricated layer to form solder pads arranged corresponding to pins of a component; providing a second insulating layer on the processed prefabricated layer, forming first through holes at portions corresponding to the solder pads on the second insulating layer, and filling the first through holes with a conductive adhesive material; attaching the component to a first daughter board, the pins of the component being plugged into the first through holes; providing, on a first insulating layer, a groove matched with the component; and press-fitting the first daughter board and a second daughter board.
Inventors:
LI JUAN (CN)
CHEN LIQIN (CN)
LI YANGUO (CN)
CHEN LIQIN (CN)
LI YANGUO (CN)
Application Number:
PCT/CN2018/093632
Publication Date:
June 06, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
International Classes:
H05K1/18; H05K3/32
Foreign References:
| CN107949166A | 2018-04-20 | |||
| CN101184363A | 2008-05-21 | |||
| US6446317B1 | 2002-09-10 | |||
| KR100667915B1 | 2007-01-11 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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