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Patent Searching and Data


Title:
RIGID-FLEX COMBINED CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/105032
Kind Code:
A1
Abstract:
The present invention relates to a rigid-flex combined board and a production method therefor, the rigid-flex combined board comprising a first flexible core board, a second flexible core board, a first circuit board and a second circuit board. One side surface of the first circuit board and one side surface of the second circuit board are connected to the first flexible core board, while the other side surface of the first circuit board and the other side surface of the second circuit board are connected to the second flexible core board. In the rigid-flex combined board, a region corresponding to a space that is on the first flexible core board and the second flexible core board and that is between the first circuit board and the second circuit board is a bendable region, thus achieving a bending function for the rigid-flex combined board. Additionally, the first flexible core board and the second flexible core board have enough signal transmission lines to turn on electronic components on the first circuit board and the second circuit board. In addition, transmission signals from external devices are directly transmitted to the first flexible core board and the second flexible core board on an outer surface layer, which may prevent loss from occurring when transmitting signals by means of through holes.

Inventors:
LIN CHUTAO (CN)
LI YANGUO (CN)
CHEN BEI (CN)
Application Number:
PCT/CN2018/093624
Publication Date:
June 06, 2019
Filing Date:
June 29, 2018
Export Citation:
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Assignee:
GUANGZHOU FASTPRINT CIRCUIT TECH CO LTD (CN)
SHENZHEN FASTPRINT CIRCUIT TECH CO LTD (CN)
International Classes:
H05K1/02
Foreign References:
CN107949152A2018-04-20
CN105307387A2016-02-03
CN205283941U2016-06-01
CN104394643A2015-03-04
US5004639A1991-04-02
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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