Title:
FIBER BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/035254
Kind Code:
A1
Abstract:
Provided are a fiber board having high dimensional stability and excellent planar tensile strength, in which a binder having high adhesiveness and being curable within a short period of time is used, and a method for manufacturing the fiber board. The fiber board is obtained by hot-press molding a mixture, said mixture comprising a powdery saccharide, a powdery binder containing a divalent or higher acid and a vegetable fiber, wherein the binder contains a powdery organic substance added thereto.
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Inventors:
NAITO SHIGEKI
SUGAWARA RYO
IKEMURA TAKESHI
UEYAMA YOSHIO
SUGAWARA RYO
IKEMURA TAKESHI
UEYAMA YOSHIO
Application Number:
PCT/JP2015/003922
Publication Date:
March 10, 2016
Filing Date:
August 04, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B27N3/04
Foreign References:
JP2014051568A | 2014-03-20 | |||
JP2011005679A | 2011-01-13 | |||
JP2012036369A | 2012-02-23 | |||
JP5244670B2 | 2013-07-24 |
Attorney, Agent or Firm:
NISHIZAWA, TOSHIO (JP)
Toshio Nishizawa (JP)
Toshio Nishizawa (JP)
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