Title:
FIBRE-REINFORCED POLYIMIDE RESIN COMPOSITION FOR SUCTION BLOW MOULDING AND MOULDED ARTICLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/241026
Kind Code:
A1
Abstract:
Provided are: a polyimide resin composition with which it is possible to use suction blow moulding to mould hollow moulded articles, such as ducts and pipes, that have a long, curved shape or other complex three-dimensional shapes, without producing burrs during moulding; and a moulded article using said polyimide resin composition. This polyimide resin composition, which contains a crystalline polyimide resin (A), a polyimide resin (B) that has does not have a melting point or has a lower melting point than the crystalline polyimide resin (A), a fibre-reinforcing material (C), and a thickener (D), is characterised in that the cooling crystallisation temperature (Tc: °C) of the polyimide resin composition, found by differential scanning calorimetry (DSC), satisfies the relationship (i) below, and the melt flow index of the polyimide resin composition satisfies the relationship (ii) below: (i) TcA − G − 4 ≤ TcX ≤ TcA − G + 4, TcA: cooling crystallisation temperature (°C) of the polyimide resin (A), TcX: cooling crystallisation temperature (°C) of the polyimide resin composition, G: content (mass%) of the fibre-reinforcing material (C) in the polyimide resin composition, and (ii) the melt flow index of the polyimide resin composition is 1.5 to 7 g/10 min, as measured under a load of 10 kg at a temperature of the melting point of the crystalline polyimide resin (A) + 10°C in accordance with JIS K-7210.
Inventors:
YOSHIMURA NOBUHIRO (JP)
Application Number:
PCT/JP2021/014921
Publication Date:
December 02, 2021
Filing Date:
April 08, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08K7/14; C08L77/00; C08L101/12
Domestic Patent References:
| WO2017086289A1 | 2017-05-26 |
Foreign References:
| JP2009132908A | 2009-06-18 | |||
| JP2014518298A | 2014-07-28 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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