Title:
FILM ADHESIVE AND SHEET FOR SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2020/196156
Kind Code:
A1
Abstract:
The present invention is a thermosetting film adhesive which satisfies, before and after storage for seven days at 40°C and before thermosetting, the following conditions (1) and (2). (1) The storage elastic modulus G' of the film adhesive at 80°C is 3 × 104 Pa or less. (2) In a central 1.1 mm × 5 mm region of a portion of a glass substrate where 10 mm × 10 mm × 20 µm of the film adhesive is pressure bonded, by applying a load of 1.96 N at 80°C for one second, to a copper wiring side of the glass substrate containing the copper wiring with a line/space (L/S) of 100 µm/100 µm and a thickness of 10 µm, the air persistence ratio, out of 100 area% of said space portion, is 20 area% or less.
Inventors:
TANAKA YUYA (JP)
Application Number:
PCT/JP2020/011975
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J201/00; C09J7/35; H01L21/301; H01L21/52
Domestic Patent References:
| WO2015037631A1 | 2015-03-19 | |||
| WO2016121488A1 | 2016-08-04 |
Foreign References:
| JP2008231366A | 2008-10-02 | |||
| JP2016216562A | 2016-12-22 | |||
| JP2004327623A | 2004-11-18 | |||
| JP2012167174A | 2012-09-06 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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