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Title:
FILM BODY AND DIELECTRIC STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/021629
Kind Code:
A1
Abstract:
The present application provides a film body and a dielectric structure. The film body comprises: a flexible substrate layer (100); and a metal circuit layer (200). The metal circuit layer (200) is provided in the flexible substrate layer (100); the metal circuit layer (200) comprises a plurality of metal basic units (210) distributed in an array; each metal basic unit (210) comprises a sealing member (211), a first coupling body (212) and a second coupling body (213); the first coupling body (212) and the second coupling body (213) are respectively connected to the sealing member (211); and the centers of the first coupling body (212) and the second coupling body (213) are symmetrically provided in the sealing member (211).

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Inventors:
WU WEI (CN)
ZHAO ZHIYONG (CN)
Application Number:
PCT/CN2023/081682
Publication Date:
February 01, 2024
Filing Date:
March 15, 2023
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H05K9/00; H05K1/02
Foreign References:
CN218244264U2023-01-06
CN113688550A2021-11-23
CN107171042A2017-09-15
CN111129780A2020-05-08
CN214796783U2021-11-19
CN215119253U2021-12-10
EP3627619A12020-03-25
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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