METHOD FOR ALLEVIATING CVD PARTICLE POORNESS AND CONTAMINATION

WIPO Patent Application WO/2024/021628

A1

The present invention relates to the technical field of machinery. A method for alleviating CVD particle poorness and contamination comprises the following steps: step 1, placing a 6-inch wafer box into a transfer wafer cassette, wherein the transfer wafer cassette comprises a front side plate and a rear side plate which are arranged front and back, the front side plate and the rear side plate are connected by means of connecting rods, slots into which the wafer box is longitudinally inserted are formed in the inner walls of the front side plate and the rear side plate, and manipulator grabbing rods are detachably connected to the left and right ends of the top of the front side plate and the left and right ends of the top of the rear side plate; step 2, placing the transfer wafer cassette into a liquor tank of a 8-inch cleaning device; step 3, cleaning for 360 seconds by using pure water; step 4, taking out the transfer wafer cassette and putting same into a spin dryer; step 5, taking out the transfer wafer cassette from the spin dryer; and step 6, taking out the 6-inch wafer box from the transfer wafer cassette. According to the present invention, the cleaning process before CVD is optimized, and the defects caused by manual wafer transfer are avoided.

ZHUANG YUNJUAN (CN)
HONG YI (CN)

PCT/CN2023/081617

February 01, 2024

March 15, 2023

Click for automatic bibliography generation  

SHANGHAI SEMICONDUCTOR WAFER TECH CO LTD (CN)

H01L21/677; H01L21/673; H01L21/687

CN115472541A	2022-12-13
CN111261495A	2020-06-09
CN201117640Y	2008-09-17
CN112635301A	2021-04-09
CN201732773U	2011-02-02
US20160104633A1	2016-04-14

SHANGHAI DAYCREATE INTELLECTUAL PROPERTY CO., LTD. et al. (CN)

View/Download PDF      PDF Help

Previous Patent: CONSORTIUM BLOCKCHAIN MANAGEMENT METHOD AND RELATED SYSTEM

Next Patent: FILM BODY AND DIELECTRIC STRUCTURE