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Patent Searching and Data


Title:
FILM-CUTTING UNIT
Document Type and Number:
WIPO Patent Application WO/2013/129082
Kind Code:
A1
Abstract:
Provided is a film-cutting unit that is always capable of clean cuts without cutting debris adhering to the cutting blade (21) even when a film (M) is cut. The film-cutting unit is configured from: a main body (20) in which a disc-shaped cutting blade has been installed on a unit frame (10) so as to be capable of rotating and revolving; a revolution drive mechanism (30) for revolving the cutting blade; a rotation drive mechanism (40) for rotating the cutting blade; a cutting debris-suctioning section (50) that removes powdered cutting debris, which is generated when the cutting blade cuts a label-forming base material (M), by suction; and a blade surface-wiping section (60) that wipes off cutting debris adhering to the surface of the cutting blade. Except for the margin where the blade is formed, both the front and back surfaces of the cutting blade have been roughened by shot blasting using a powder of fused alumina, etc. of 0.1-500 µm mean particle diameter and have a surface roughness with an arithmetic mean roughness (Ra) as defined by JIS B 0601-1994 of 0.025a-100a and a ten-spot average roughness (Rz) of 0.1-400Z.

Inventors:
SUGIMOTO HIROSHI (JP)
NII SATOSHI (JP)
ODE HIDEKI (JP)
Application Number:
PCT/JP2013/053022
Publication Date:
September 06, 2013
Filing Date:
February 08, 2013
Export Citation:
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Assignee:
FUJI SEAL INT INC (JP)
International Classes:
B26D1/14; B26D3/00; B26D7/18; B65C3/14
Foreign References:
JPH04217491A1992-08-07
JPH03154797A1991-07-02
JP2756524B21998-05-25
JPH0497691U1992-08-24
JP2010052209A2010-03-11
JP2002172707A2002-06-18
JPH0516189U1993-03-02
JP2002144279A2002-05-21
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Claims: