Title:
FILM-FORM ADHESIVE, ADHESIVE FILM, INTEGRATED DICING/DIE BONDING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057791
Kind Code:
A1
Abstract:
Provided is a film-form adhesive configured from a resin composition that has thermal curing properties and contains a filler, the film-form adhesive being of a single-layer structure that has a first surface and a second surface, wherein the film-form adhesive has a region in which the filler content decreases from the second-surface side toward the first-surface side, the region being near the first surface of the film-form adhesive.
Inventors:
KAYA MICHIKO (JP)
AOYAGI SHOTA (JP)
NAKAYAMA NORIYUKI (JP)
KIMURA MIKIKO (JP)
AOYAGI SHOTA (JP)
NAKAYAMA NORIYUKI (JP)
KIMURA MIKIKO (JP)
Application Number:
PCT/JP2023/029170
Publication Date:
March 21, 2024
Filing Date:
August 09, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/52; C09J5/00; C09J7/30; C09J11/04; C09J11/08; C09J133/00; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2012165273A1 | 2012-12-06 |
Foreign References:
| JP2022102458A | 2022-07-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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