Title:
FILM-LIKE ADHESIVE AGENT, ADHESIVE FILM, DICING/DIE-BONDING INTEGRATED FILM, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/057792
Kind Code:
A1
Abstract:
This film-like adhesive agent is formed of a resin composition having thermosetting properties and containing a filler, and has a single-layer structure including a first surface and a second surface. The film-like adhesive agent has a region A which is near the first surface and in which the contained amount of the filler decreases from the second surface side toward the first surface side, and a region B in which the contained amount of the filler does not substantially change in a direction toward the first surface side from the second surface side of the film-like adhesive agent. When the film-like adhesive agent is cured by heating, formula (1) is satisfied where a (nm) represents the thickness of the region A of the film-like adhesive agent after heat curing, and b (Pa) represents the elastic modulus of the region B, and c (Pa) represents the elastic modulus of mica. (1): a × (b/c) > 50
Inventors:
KAYA MICHIKO (JP)
AOYAGI SHOTA (JP)
AOYAGI SHOTA (JP)
Application Number:
PCT/JP2023/029171
Publication Date:
March 21, 2024
Filing Date:
August 09, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/52; C09J5/00; C09J7/30; C09J11/04; C09J11/08; C09J133/00; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2012165273A1 | 2012-12-06 |
Foreign References:
| JP2022102458A | 2022-07-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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