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Title:
FILM FORMING APPARATUS AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/062801
Kind Code:
A1
Abstract:
This film forming apparatus is provided with: a substrate supporting means which supports a substrate; an alignment means which performs an alignment of the substrate and a mask; and a vapor deposition means which discharges a vapor deposition material onto the substrate by the intermediary of the mask. This film forming apparatus is also provided with an electrostatic chuck which sucks the mask from the reverse side from the substrate during the alignment operation by the alignment means.

Inventors:
NAGAOKA KEN (JP)
Application Number:
PCT/JP2023/029420
Publication Date:
March 28, 2024
Filing Date:
August 14, 2023
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Assignee:
CANON TOKKI CORP (JP)
International Classes:
C23C14/04; C23C14/24; H01L21/683
Foreign References:
JP2020530875A2020-10-29
JP2011195907A2011-10-06
JP2015028204A2015-02-12
JP2019513289A2019-05-23
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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