FILM FORMING METHOD AND FILM FORMING APPARATUS

Title:

FILM FORMING METHOD AND FILM FORMING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2020/091016

Kind Code:

A1

Abstract:

This film forming method forms a film on a base material surface that comprises a first region where a metal or a semiconductor is exposed and a second region where an insulating body is exposed; and this film forming method comprises an SAM formation step wherein a self-assembled monomolecular film of a perfluoropolyether group-containing compound is formed in the first region, and a film growth step wherein a predetermined film is formed in the second region after the execution of the SAM formation step.

Inventors:

FUSE TAKASHI (JP)
NAMIKAWA TAKASHI (JP)

Application Number:

PCT/JP2019/042929

Publication Date:

May 07, 2020

Filing Date:

October 31, 2019

Export Citation:

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Assignee:

TOKYO ELECTRON LTD (JP)
DAIKIN IND LTD (JP)

International Classes:

C23C14/12; C23C14/04; C23C16/04; C23C26/00; H01L21/027

Domestic Patent References:

WO2017151639A1

2017-09-08

Foreign References:

JP2013154315A	2013-08-15
JP2018078102A	2018-05-17