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Title:
FILM-LIKE ADHESIVE AGENT, ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/136774
Kind Code:
A1
Abstract:
[Problem] To provide a film-like adhesive agent and an adhesive sheet which are suitable for a breaking method with a heated gas. [Solution] The film-like adhesive agent according to the present invention comprises a polymer component (A) and a heat-curable component (B1), wherein the content of the polymer component (A) is 1 to 30% by mass and the content of the heat-curable component (B1) is 40 to 70% by mass in the film-like adhesive agent. The film-like adhesive agent can be used in such a way that the film-like adhesive agent is bonded to a group of chips, which consists of multiple chips, and then a heated gas is emitted toward the film-like adhesive agent to melt the film-like adhesive agent.

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Inventors:
KARASAWA YASUNORI (JP)
KUROSAWA YUTA (JP)
SATO AKINORI (JP)
Application Number:
PCT/JP2016/055344
Publication Date:
September 01, 2016
Filing Date:
February 24, 2016
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/10; C09J201/00; H01L21/301; H01L21/52
Foreign References:
JP2012164953A2012-08-30
JP2006093213A2006-04-06
JP2008274259A2008-11-13
JP2008133456A2008-06-12
Attorney, Agent or Firm:
MAEDA & SUZUKI (JP)
Maeda and a Suzuki international patent business corporation (JP)
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