Title:
FILM-LIKE ADHESIVE FOR FLEXIBLE DEVICE, ADHESIVE SHEET FOR FLEXIBLE DEVICE, AND METHOD FOR MANUFACTURING FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/136018
Kind Code:
A1
Abstract:
Provided are: a film-like adhesive for a flexible device, wherein the thickness T (μm) of the film-like adhesive and the storage modulus E' (GPa) of the cured product of the film-like adhesive satisfy T×E'≤75; a flexible sheet for a flexible device, the flexible sheet being formed by layering this film-like adhesive and a flexible substrate; and a method for manufacturing a flexible device using the adhesive and the substrate.
Inventors:
SAKAI KOYUKI (JP)
Application Number:
PCT/JP2022/045722
Publication Date:
July 20, 2023
Filing Date:
December 12, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J7/30; B32B27/38; C09J163/00; H01L23/29; H01L23/31; H05B33/02; H05B33/04; H05B33/10; H10K50/00; H10K59/00
Foreign References:
| JP2017110128A | 2017-06-22 | |||
| JP2002226796A | 2002-08-14 | |||
| JPH11265960A | 1999-09-28 | |||
| JP2018188540A | 2018-11-29 |
Other References:
YOKOYAMA NAOKI, OSAMU AMESAWA, KATSUYUKI AIDA, ,YUKIKO OGURA, KOJI NITTA,,SHINYA TAKAHASHI, TOMOYUKI KASEMURA: "Morphologies and Properties of Cured Epoxy/Phenoxy/Cycrophenoxyphosphazen (CPP) Blends as Adhesives for Flexible Printed Circuits (FPCs)", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 45, no. 9, 1 January 2009 (2009-01-01), pages 330 - 337, XP093078793
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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