Title:
RESIN COMPOSITION FOR FLEXIBLE DEVICE, FILM-LIKE ADHESIVE FOR FLEXIBLE DEVICE, ADHESIVE SHEET FOR FLEXIBLE DEVICE, AND METHOD FOR MANUFACTURING FLEXIBLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/136017
Kind Code:
A1
Abstract:
Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60°C or higher and the storage modulus of the cured product is 5.0 GPa or lower. Also provided: are a film-like adhesive using the resin composition for a flexible device; an adhesive sheet having a layered structure of the film-like adhesive composition and a flexible substrate; and a method for manufacturing a flexible device.
Inventors:
SAKAI KOYUKI (JP)
Application Number:
PCT/JP2022/045721
Publication Date:
July 20, 2023
Filing Date:
December 12, 2022
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C08G59/40; C08L63/00; C08L71/10; C09J7/30; C09J163/02; C09J171/00; H01L21/52
Domestic Patent References:
| WO2020251030A1 | 2020-12-17 | |||
| WO2021200757A1 | 2021-10-07 | |||
| WO2020251030A1 | 2020-12-17 | |||
| WO2017158994A1 | 2017-09-21 |
Foreign References:
| JP2012241147A | 2012-12-10 | |||
| JP2012097195A | 2012-05-24 | |||
| JP2021123029A | 2021-08-30 | |||
| JP2022003639A | 2022-01-11 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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