Title:
FILM FOR PROTECTIVE FILM FORMATION AND COMPOSITE SHEET FOR PROTECTIVE FILM FORMATION
Document Type and Number:
WIPO Patent Application WO/2017/073627
Kind Code:
A1
Abstract:
A film for protective film formation, which contains an energy ray-curable compound (B) and has the characteristics described below, and which is used for the purpose of forming a protective film on the back surface of a semiconductor wafer or a semiconductor chip.
If a cured product is obtained by curing this film for protective film formation by means of energy ray irradiation, the cured product has a Young's modulus of 500 MPa or more and an elongation at break of 8% or more.
Inventors:
INAO YOUICHI (JP)
KOBASHI RIKIYA (JP)
FURUNO KENTA (JP)
KOBASHI RIKIYA (JP)
FURUNO KENTA (JP)
Application Number:
PCT/JP2016/081752
Publication Date:
May 04, 2017
Filing Date:
October 26, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C08F2/46; C09J4/00; C09J7/20; H01L21/301; H01L23/00
Domestic Patent References:
| WO2011089664A1 | 2011-07-28 | |||
| WO2011152045A1 | 2011-12-08 | |||
| WO2016027883A1 | 2016-02-25 |
Foreign References:
| JP2004214288A | 2004-07-29 | |||
| JP2005277297A | 2005-10-06 | |||
| JP2009147277A | 2009-07-02 | |||
| JP2012049388A | 2012-03-08 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Download PDF: