Title:
FILM REMOVAL METHOD AND FILM REMOVAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053744
Kind Code:
A1
Abstract:
This film removal method is for removing, from an electric wire having a core wire and an insulating film made of an organic polymer material, the insulating film through irradiation with laser light. The insulating film is removed from each site in a region of the surface of the electric wire from which the insulating film is to be removed, through irradiation with laser light performed a plurality of times. The film removal method optionally comprises: a first step for reducing the thickness of the insulating film by irradiating the surface of the electric wire with laser light; and a second step for removing the insulating film by irradiating the insulating film having the thickness reduced in the first step with laser light. In the first step, the thickness of the film may be reduced to at most 1 [μm].
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Inventors:
MATSUMOTO RYOYA (JP)
SUGA SAYO (JP)
SHIGEMATSU TAKASHI (JP)
SAKAI TOSHIAKI (JP)
HARA NATSUKO (JP)
YOSHIDA SHO (JP)
SUGA SAYO (JP)
SHIGEMATSU TAKASHI (JP)
SAKAI TOSHIAKI (JP)
HARA NATSUKO (JP)
YOSHIDA SHO (JP)
Application Number:
PCT/JP2023/032929
Publication Date:
March 14, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H02G1/12; B23K26/00; B23K26/082; B23K26/351; B23K26/36
Domestic Patent References:
| WO2021132677A1 | 2021-07-01 |
Foreign References:
| JP2008109753A | 2008-05-08 | |||
| JPH08182142A | 1996-07-12 | |||
| JPH0582228A | 1993-04-02 | |||
| JP2001224114A | 2001-08-17 | |||
| JPH01232303A | 1989-09-18 | |||
| JPH077825A | 1995-01-10 | |||
| JP2015228298A | 2015-12-17 | |||
| JP2017220634A | 2017-12-14 | |||
| JP2019155375A | 2019-09-19 | |||
| JP2021158819A | 2021-10-07 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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