Title:
SEISMIC PROFILING METHOD, UNDERGROUND MONITORING METHOD, SEISMIC PROFILING SYSTEM, AND EPICENTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053743
Kind Code:
A1
Abstract:
A seismic profiling method according to the present invention comprises a vibration generation process in which an epicenter device 10 disposed underground generates vibration, and an acquisition process in which a signal acquisition device 20 acquires a vibration signal based on the vibration generated by the epicenter device 10. The epicenter device 10 comprises eccentric rotating bodies 170, 180 that rotate about a rotational axis, and a drive unit 160 that generates vibration by causing the rotating bodies to rotate.
Inventors:
TSUJI TAKESHI (JP)
Application Number:
PCT/JP2023/032924
Publication Date:
March 14, 2024
Filing Date:
September 08, 2023
Export Citation:
Assignee:
UNIV TOKYO (JP)
International Classes:
G01V1/00; G01V1/047; G01V1/153
Domestic Patent References:
| WO2016135868A1 | 2016-09-01 |
Foreign References:
| JPH01301190A | 1989-12-05 | |||
| JP2020522699A | 2020-07-30 | |||
| JPH01265185A | 1989-10-23 | |||
| US20120145476A1 | 2012-06-14 | |||
| JP2009175122A | 2009-08-06 | |||
| JPS6296884A | 1987-05-06 |
Attorney, Agent or Firm:
MORISHITA Sakaki (JP)
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