Title:
FILM THICKNESS MEASUREMENT METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/223845
Kind Code:
A1
Abstract:
This film thickness measurement method includes a storage step, a substrate processing step, a measurement step, and a derivation step. The storage step is for storing, in a storage unit, relationship information showing a relationship between the film thickness of a film present on a surface of a substrate in which recesses are formed and which has been processed, and an absorbance spectrum of the processed substrate, which is an absorbance spectrum in a range that includes a peak of at least one among the LO (longitudinal optical) phonon and TO (transverse optical) phonon of the film on the substrate. The substrate processing step is for processing the substrate in which recesses are formed. The measurement step is for measuring the absorbance spectrum of the processed substrate. The derivation step is for deriving the film thickness of the film present on the surface of the processed substrate from the measured absorbance spectrum on the basis of the relationship information.
Inventors:
OTSUKI YUJI (US)
KAGAYA MUNEHITO (JP)
SUZUKI YUSUKE (JP)
KAGAYA MUNEHITO (JP)
SUZUKI YUSUKE (JP)
Application Number:
PCT/JP2023/017163
Publication Date:
November 23, 2023
Filing Date:
May 02, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; C23C16/52; H01L21/31; H01L21/66
Foreign References:
| JP2021195609A | 2021-12-27 | |||
| JP2018107202A | 2018-07-05 | |||
| JP2004253424A | 2004-09-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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