Title:
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BOARD, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/223846
Kind Code:
A1
Abstract:
A wiring board according to the present invention comprises a first insulating layer, a second insulating layer, a conductor layer, a first grounding conductor, and a second grounding conductor. The conductor layer has a pair of first signal lines and a pair of second signal lines extending in a first direction. The second grounding conductor has a pair of first openings and a pair of second openings, and the second insulating layer has a pair of first through-conductors, a pair of second through-conductors, and a central through-conductor. The pair of first through-conductors are positioned inside the pair of first openings and is connected to the pair of first signal lines, and the pair of second through-conductors are positioned inside the pair of second openings and are connected to the pair of second signal lines. The central through-conductor is positioned between the pair of first openings and the pair of second openings and is connected to the first grounding conductor and the second grounding conductor, and is a grounding through-conductor that approaches the first through-conductor and the second through-conductor in a second direction intersecting the first direction.
Inventors:
KON TOMOYA (JP)
Application Number:
PCT/JP2023/017168
Publication Date:
November 23, 2023
Filing Date:
May 02, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/02; H01L23/02; H01L23/12
Domestic Patent References:
| WO2021145015A1 | 2021-07-22 | |||
| WO2016186128A1 | 2016-11-24 |
Foreign References:
| JP2018200949A | 2018-12-20 | |||
| US20020084876A1 | 2002-07-04 |
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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