Title:
FILM
Document Type and Number:
WIPO Patent Application WO/2018/207824
Kind Code:
A1
Abstract:
A film comprising a base layer and a sealing layer and having a thickness of 20-150 μm, the base layer being one surface layer of the film and the sealing layer being the other surface layer. The sealing layer comprises a resin composition and has a thickness of 5-100 μm. The surface of the sealing layer which is a film surface has a crystallization index of 0.680-0.900. When the film-surface sealing layer is kept in contact with an adherend (X) and the film is heat-sealed to the adherend (X) under the conditions of a temperature of 160°C, a time of 1 second, a sealing-bar width of 10 mm, and a pressure of 450 kPa, then some of the resin composition of the sealing layer oozes from the heat-seal part to the non-heat-seal part and solidifies to form a solidified part, the ratio of the thickness of the solidified part to the thickness of the sealing layer in the non-heat-seal part being 1.80-2.20.
Adherend (X): an adherend having a thickness of 350-550 μm and comprising an impact-resistant polystyrene that has a melt flow rate of 3.0-4.0 g/10 min and a Vicat softening temperature of 95-100°C.
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Inventors:
LIU CHEN (JP)
YANO TAKAAKI (JP)
KUWASAKI NAOTO (JP)
YANO TAKAAKI (JP)
KUWASAKI NAOTO (JP)
Application Number:
PCT/JP2018/017947
Publication Date:
November 15, 2018
Filing Date:
May 09, 2018
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L23/04; B32B27/00; B32B27/32; B65D65/40; C08L31/02; C08L33/04; C08L45/00; C08L65/00
Domestic Patent References:
| WO2018062389A1 | 2018-04-05 |
Foreign References:
| JP2007519814A | 2007-07-19 | |||
| US20160215176A1 | 2016-07-28 | |||
| JP2014076543A | 2014-05-01 | |||
| JP2002226642A | 2002-08-14 |
Other References:
HISHINUMA, KAZUO: "The development of the discrimination method of peeling seal and tearing seal in heat sealing", JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY, vol. 14, no. 6, 1 December 2005 (2005-12-01), pages 401 - 409
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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