Title:
FLEXIBLE CIRCUIT BOARD AND PREPARATION METHOD THEREFOR, TOUCH PANEL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/047676
Kind Code:
A1
Abstract:
A flexible circuit board (10) and a preparation method therefor, and a touch panel and a preparation method therefor. The flexible circuit board (10) has a first binding area (1) and a bending area (2); the flexible circuit board (10) comprises a flexible substrate (3), a conductor layer (42), a first protective layer (51) and a plurality of first binding pins (41); the plurality of first binding pins (41) are arranged on the flexible substrate (3) of the first binding area (1), and the orthographic projection, on the flexible substrate (3), of an edge line of the first binding pins (41) at one end in an extending direction of the first binding pins (41) is located within an edge of the flexible substrate (3); the conductor layer (42) is arranged on the flexible substrate (3) of the bending area (2), and the conductor layer (42) is connected to the first binding pins (41); and the first protective layer (51) is arranged on the side of the conductor layer (42) away from the flexible substrate (3). During binding, even if conductive particles (8) are squeezed to the edge of the flexible substrate (3) to cause aggregation of the conductive particles (8), a short circuit will not occur between the plurality of first binding pins (41).
Inventors:
WANG JIUZHEN (CN)
ZHENG MEIZHU (CN)
ZHENG MEIZHU (CN)
Application Number:
PCT/CN2020/113073
Publication Date:
March 10, 2022
Filing Date:
September 02, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
G06F3/041; H05K1/02; H05K1/11; H05K3/42
Foreign References:
| CN110825268A | 2020-02-21 | |||
| CN109831871A | 2019-05-31 | |||
| CN1792126A | 2006-06-21 | |||
| CN210137483U | 2020-03-10 | |||
| CN110505756A | 2019-11-26 | |||
| CN107611160A | 2018-01-19 |
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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