Title:
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/065490
Kind Code:
A1
Abstract:
A flexible printed circuit board according to the present invention is provided with: an insulating base material that has a circuit formation surface; and a circuit unit that is provided on a part of the circuit formation surface of the insulating base material. The circuit unit comprises a copper layer; and with respect to the copper layer, a first surface that is on the reverse side from the circuit formation surface of the insulating base material has a surface-roughened non-(100) plane region that is composed of a crystal plane other than the (100) plane of the copper layer, and a (100) plane region that is composed of the (100) plane of the copper layer. A plurality of first pits, each of which has a quadrangular opening, are formed in the (100) plane region.
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Inventors:
FUJINAMI HIDEYUKI (JP)
FUJIMOTO TAKUYA (JP)
FUJIMOTO TAKUYA (JP)
Application Number:
PCT/JP2020/034991
Publication Date:
April 08, 2021
Filing Date:
September 15, 2020
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
H05K1/02; H05K1/09; H05K3/06; H05K3/00
Domestic Patent References:
| WO2016093109A1 | 2016-06-16 | |||
| WO2012043462A1 | 2012-04-05 |
Foreign References:
| JP2011233648A | 2011-11-17 | |||
| JP3040461U | 1997-08-19 |
Attorney, Agent or Firm:
AOKI Hiroaki (JP)
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