Title:
FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/110422
Kind Code:
A1
Abstract:
A flexible substrate according to one embodiment of the present invention is provided with: a flexible insulating base material; and a plurality of wiring lines that are provided on one surface of the insulating base material. This flexible substrate is configured such that: the insulating base material has a thinned first region and a second region that has a larger film thickness than the first region; the first region has a first lower surface; the second region has a second lower surface; the first lower surface and the second lower surface are formed in a surface of the insulating base material, said surface being on the reverse side of the surface on which the wiring lines are provided; and the first lower surface has an inclined part that is inclined toward the second lower surface.
Inventors:
SANO TAKUMI (JP)
Application Number:
PCT/JP2019/035582
Publication Date:
June 04, 2020
Filing Date:
September 10, 2019
Export Citation:
Assignee:
JAPAN DISPLAY INC (JP)
International Classes:
H05K1/02
Foreign References:
JP2009076663A | 2009-04-09 | |||
US20160293571A1 | 2016-10-06 | |||
US9391286B1 | 2016-07-12 | |||
US8207473B2 | 2012-06-26 | |||
JP2016027627A | 2016-02-18 |
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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