Title:
FLOW SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/168664
Kind Code:
A1
Abstract:
A flow soldering device (1) is provided with a flux application unit (1), a preheating unit (5), a flow soldering body unit (7), and a transport mechanism (9). In the flow soldering body unit (7), jet nozzles (19), dross suppression devices (31), a solder bath heater (21), impellers (23), and jet motors (25) are arranged in a solder bath (15) storing a molten solder (17). The dross suppression devices (31) are arranged in a floating manner on the molten solder (17) in a region where the molten solder (17) jetted from the jet nozzles (19) falls onto the molten solder (17) stored in the solder bath (15).
More Like This:
| JPH05146869 | NITROGEN-SEALED TYPE SOLDERING DEVICE |
Inventors:
MINAMI NORIYA (JP)
TAHARA TAKASHI (JP)
TAHARA TAKASHI (JP)
Application Number:
PCT/JP2022/002582
Publication Date:
August 11, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K1/08; B23K3/06; H05K3/34
Foreign References:
| JP2011035086A | 2011-02-17 | |||
| JP3193699U | 2014-10-16 | |||
| JP2007196241A | 2007-08-09 | |||
| JPS5429124U | 1979-02-26 | |||
| JP2002314238A | 2002-10-25 | |||
| JP2002016349A | 2002-01-18 | |||
| JPH05329631A | 1993-12-14 | |||
| JP2007237269A | 2007-09-20 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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