Title:
FLUID DEVICE AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/180871
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a fluid device in which a first substrate and a second substrate forming a flow path can be efficiently welded. The fluid device is provided with a first substrate and a second substrate bonded at a bonding surface. The second substrate comprises: a groove in the bonding surface for forming a flow path by the first substrate and the second substrate being bonded together; a welding region which is disposed in an area from a first boundary with the groove to a second boundary a prescribed distance away; a containment unit which, on the side of the second boundary opposite of the welding region, is formed opening toward the bonding surface side, and which, when the first substrate and the second substrate are bonded, contains a substance that has a lower thermal conductivity than that of the first substrate and the second substrate.
Inventors:
ISHIZAWA NAOYA (JP)
KOBAYASHI RYO (JP)
UENO TARO (JP)
TAKASAKI TETSUOMI (JP)
KOBAYASHI RYO (JP)
UENO TARO (JP)
TAKASAKI TETSUOMI (JP)
Application Number:
PCT/JP2018/011393
Publication Date:
September 26, 2019
Filing Date:
March 22, 2018
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
G01N35/10; G01N37/00
Domestic Patent References:
| WO2010109934A1 | 2010-09-30 |
Foreign References:
| JP2017029941A | 2017-02-09 | |||
| JP2006283965A | 2006-10-19 |
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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