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Title:
FLUORINATED POLYAMIDE COMPOUND, FLUORINATED POLYIMIDE COMPOUND, LOW DIELECTRIC MATERIAL, AND HIGH-FREQUENCY ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/219085
Kind Code:
A1
Abstract:
The present disclosure provides fluorinated polyamide compounds and fluorinated polyimide compounds having specific repeating units.

Inventors:
OISHI YOSHIYUKI (JP)
OTA DAISUKE (JP)
Application Number:
PCT/JP2023/017477
Publication Date:
November 16, 2023
Filing Date:
May 09, 2023
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
NATIONAL UNIV CORPORATION IWATE UNIV (JP)
International Classes:
C08G69/42; C08G73/10; H05K1/03
Foreign References:
JP2021178955A2021-11-18
JP2021178956A2021-11-18
JPH04288344A1992-10-13
JPH02208324A1990-08-17
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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