Title:
FLUORINE-CONTAINING RESIN COMPOSITION AND RESIN GLUE SOLUTION COMPRISING SAME, FLUORINE-CONTAINING DIELECTRIC SHEET, LAMINATED BOARD, COPPER CLAD BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/120921
Kind Code:
A1
Abstract:
A fluorine-containing resin composition and a resin glue solution comprising same, a fluorine-containing dielectric sheet, a laminated board, a copper clad board, and a printed circuit board. The fluorine-containing resin composition comprises the following components: 30wt%-70wt% of a fluorine-containing polymer, and 30wt%-70wt% of an inorganic filler; and the inorganic filler comprises the following particle size distribution: D10 is greater than 1.5 μm and D50 is 10-15 μm. By selecting the inorganic filler having specific particle size distribution, even though the addition amount of the inorganic filler is large, it also can be ensured that the board made of the fluorine-containing resin composition has excellent dielectric properties and voltage resistance.
Inventors:
CHAI SONGGANG (CN)
LIU QIANFA (CN)
HAO LIANGPENG (CN)
LIANG WEI (CN)
LIU QIANFA (CN)
HAO LIANGPENG (CN)
LIANG WEI (CN)
Application Number:
PCT/CN2020/137249
Publication Date:
June 16, 2022
Filing Date:
December 17, 2020
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L27/18; B32B15/085; B32B27/06; C08K7/00; C08K7/18; H05K1/03
Foreign References:
| CN104558689A | 2015-04-29 | |||
| CN108659411A | 2018-10-16 | |||
| CN106854330A | 2017-06-16 | |||
| DE4200583A1 | 1992-07-23 | |||
| US20010053408A1 | 2001-12-20 | |||
| US20130319609A1 | 2013-12-05 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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