Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE, AND HIGH-FREQUENCY CIRCUIT SUBSTRATE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2022/120920
Kind Code:
A1
Abstract:
A thermosetting resin composition, and a resin glue solution, a prepreg, a high-frequency circuit substrate, and a printed circuit board containing same. The thermosetting resin composition contains the following solid components in parts by weight: (A) 1-40 parts of epoxy resin; (B) 1-40 parts of a maleic anhydride modifier; (C) 30-80 parts of a maleimide compound; and (D) 1-40 parts of an active ester, wherein the maleic anhydride modifier contains polybutadiene or hydrogenated polybutadiene segments. According to the thermosetting resin composition, the dielectric properties of a resin composition is effectively improved while it is ensured that the resin composition has a high Tg value and excellent moisture resistance.
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Inventors:
HUANG TIANHUI (CN)
XI LONG (CN)
LIN WEI (CN)
XI LONG (CN)
LIN WEI (CN)
Application Number:
PCT/CN2020/137246
Publication Date:
June 16, 2022
Filing Date:
December 17, 2020
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L63/00; B32B15/20; B32B27/08; B32B27/18; C08L79/04
Foreign References:
| CN108219379A | 2018-06-29 | |||
| CN102443138A | 2012-05-09 | |||
| CN101942178A | 2011-01-12 | |||
| CN106700424A | 2017-05-24 | |||
| EP3466925A1 | 2019-04-10 | |||
| EP3560968A1 | 2019-10-30 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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