Title:
FOAMABLE UNDERFILL ENCAPSULANT
Document Type and Number:
WIPO Patent Application WO2004106454
Kind Code:
A3
Abstract:
A thermoplastic or thermosetting B-stageable or pre-formed film underfill encapsulant composition that is used in the application of electronic components to substrates. The composition comprises a resin system comprising thermoplastic or thermally curable resin, an expandable microsphere, a solvent, and optionally a catalyst. Various other additives, such as adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant may be dried or B-staged to provide a coating on the substrate or component that is smooth and nontacky. In an alternative embodiment, the underfill encapsulant is a pre-formed film. In both embodiments the expandable filler material expands upon the application of higher temperatures to form a closed-cell foam structure in the desired portion of the assembly.
More Like This:
Inventors:
SHAH JAYESH
MORGANELLI PAUL
PEARD DAVID
MORGANELLI PAUL
PEARD DAVID
Application Number:
PCT/US2004/015455
Publication Date:
March 03, 2005
Filing Date:
May 18, 2004
Export Citation:
Assignee:
NAT STARCH CHEM INVEST (US)
International Classes:
C08L71/00; H01L21/56; H01L23/29; (IPC1-7): C09J163/00; C08L63/00; C09J171/00; H01L21/00
Domestic Patent References:
| WO2000034032A1 | 2000-06-15 | |||
| WO2003020816A1 | 2003-03-13 |
Foreign References:
| US20020166687A1 | 2002-11-14 | |||
| DE19758488A1 | 1999-03-25 | |||
| US6383659B1 | 2002-05-07 | |||
| EP0372880A2 | 1990-06-13 |
Download PDF:
Previous Patent: IMPROVED ADHESIVES FOR FLUOROPOLYMER FILMS AND STRUCTURES CONTAINING SAME
Next Patent: SLURRY COMPOSITION AND METHOD OF USE
Next Patent: SLURRY COMPOSITION AND METHOD OF USE