FOLDABLE ELECTRONIC DEVICE COMPRISING FLEXIBLE PRINTED CIRCUIT BOARD

WIPO Patent Application WO/2024/025341

A1

Disclosed according to an exemplary embodiment of the present disclosure is a foldable electronic device comprising: a foldable housing including a first housing, a second housing, and a hinge part which connects the first and second housings to each other; and a flexible printed circuit board which electrically connects a first element disposed in the first housing and a second element disposed in the second housing to each other and is arranged across the hinge part, wherein the flexible printed circuit board comprises: a first region which includes a first connector end electrically connected to the first element; a second region which includes a second connector end electrically connected to the second element and is arranged across the hinge part; a third region which is arranged between the first and second regions, the third region including a first portion extending in a first direction and a second portion extending to the second region in a second direction different from the first direction, and the first and third regions being disposed in the first housing; and a rigid part which is configured to connect the first or third region extending toward the hinge part to the first housing.

PARK HONJEONG (KR)
KWON KIHWAN (KR)
LEE HYUNGGEUN (KR)
JUNG YOUNGJIN (KR)

PCT/KR2023/010841

February 01, 2024

July 26, 2023

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SAMSUNG ELECTRONICS CO LTD (KR)

H04M1/02; G06F1/16; H05K1/14

KR20210101669A	2021-08-19
KR20200021172A	2020-02-28
KR20190137433A	2019-12-11
KR101670890B1	2016-10-31
US10469635B1	2019-11-05

YOON & LEE INTERNATIONAL PATENT & LAW FIRM (KR)

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