Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FORGING TOOL
Document Type and Number:
WIPO Patent Application WO/2019/189613
Kind Code:
A1
Abstract:
This forging tool 10 is a forging tool which forges a workpiece W in a rectangular-shaped forging space S having first to sixth wall surfaces 21-26. The forging tool 10 is provided with: a first mold 30 which defines the first wall surface 21 and the second wall surface 22 that is adjacent to the first wall surface 21; a second mold 40 which defines the third wall surface 23 and the fourth wall surface 24 that is adjacent to the third wall surface 23; and a third mold 60 which defines the sixth wall surface 26 in an area surrounded by a contact surface 61 when the bottom surfaces 32, 42 of the first mold 30 and the second mold 40 contact the contact surface 61. The first mold 30 defines a triangular area 25a in which a line at which the fifth wall surface 25 intersects the first wall surface 21 and a line at which the fifth wall surface 25 intersects the second wall surface 22 are two edges thereof, the second mold 49 defines a triangular area 25b in which a line at which the fifth wall surface 25 intersects the third wall surface 23 and a line at which the fifth wall surface 25 intersects the fourth wall surface 24 are two edges thereof, and the workpiece W is pressed between the fifth wall surface 25 and the sixth wall surface 26.

Inventors:
MIURA HIROMI (JP)
MURAMATSU NAOKUNI (JP)
KAWAMOTO TADAHIRO (JP)
Application Number:
PCT/JP2019/013686
Publication Date:
October 03, 2019
Filing Date:
March 28, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NGK INSULATORS LTD (JP)
MIURA HIROMI (JP)
International Classes:
B21J1/02; B21J13/02
Domestic Patent References:
WO2009119237A12009-10-01
WO2013146309A12013-10-03
Foreign References:
US20170342537A12017-11-30
JP2006116592A2006-05-11
JPS6422435A1989-01-25
JP2006116592A2006-05-11
JP2018062494A2018-04-19
Other References:
See also references of EP 3778064A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Download PDF: