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Title:
FRICTION MATERIAL COMPOSITION AND FRICTION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/250089
Kind Code:
A1
Abstract:
A friction material composition including a fiber base material, a binding material, an organic filler material, and an inorganic filler material, wherein the copper content in the friction material composition is 5 mass% or less in terms of elemental copper, and magnesite is included as the inorganic filler material.

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Inventors:
UJITA JUNICHI (JP)
HASEGAWA HIROKI (JP)
Application Number:
PCT/JP2022/021436
Publication Date:
December 01, 2022
Filing Date:
May 25, 2022
Export Citation:
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Assignee:
ADVICS CO LTD (JP)
International Classes:
C09K3/14; F16D69/02
Domestic Patent References:
WO2007052727A12007-05-10
Foreign References:
CN104909704A2015-09-16
JPS496029A1974-01-19
JP2003322183A2003-11-14
JPH08253658A1996-10-01
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