FUNCTION ELEMENT MOUNTING MODULE AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2006/030611

A1

There are provided a small-size optical function element module and its manufacturing method not requiring an expensive special member. On a substrate (2), a predetermined wiring pattern is formed and an optical function element (3) is mounted. A protrusion (7) is formed around the optical function element (3) to stem liquid sealing resin (8) on the substrate (2). The liquid sealing resin (8) is dropped into the portion between the optical function element (3) and the protrusion (7) so as to fill the portion between the optical function element (3) and the protrusion (7) with the sealing resin (8). A package constituent member (9) having a light transmission hole (9a) corresponding to the optical function unit of the optical function element (3) is brought into abutment with the protrusion (7) with the light transmission unit (9a) opposing to the optical function unit (30) of the optical function element (3). Thus, the package constituent member (9) is brought into contact with the sealing resin (8). Furthermore, the sealing resin (8) is hardened so that the package constituent member is fixed to the substrate (2). Lastly, the protrusion (7) is cut off.

YONEDA YOSHIHIRO (JP)
ASADA TAKAHIRO (JP)

PCT/JP2005/015406

March 23, 2006

August 25, 2005

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SONY CHEMICALS CORP (JP)
YONEDA YOSHIHIRO (JP)
ASADA TAKAHIRO (JP)

H01L21/56; H01L31/02; H01L23/28; H01S5/022

JP2002076376A	2002-03-15
JP2002222935A	2002-08-09
JPH11121653A	1999-04-30
JPH06342854A	1994-12-13
JPS6432682A	1989-02-02

Abe, Hideki (3F 1-2-18, Toranomo, Minato-ku Tokyo 01, JP)

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