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Patent Searching and Data


Title:
GAS BARRIER MULTILAYER BODY AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/138188
Kind Code:
A1
Abstract:
The present invention provides: a multilayer body which stably has excellent gas barrier properties regardless of the humidity in the environment of usage, and even in cases where the humidity fluctuates or the multilayer body is subjected to an impact; and a packaging material which uses this multilayer body. The above are achieved by means of: a multilayer body which comprises a first base material, a resin layer that is arranged so as to be in contact with the first base material, an inorganic vapor deposition layer that is arranged so as to be in contact with the resin layer, and a gas barrier adhesive layer that is arranged so as to be in contact with the inorganic vapor deposition layer, wherein the resin layer has a film thickness of from 0.1 μm to 5 μm; and a packaging material which is obtained using this multilayer body.

Inventors:
ARAI MASAMITSU (JP)
KOBAYASHI HIROKI (JP)
Application Number:
PCT/JP2021/045262
Publication Date:
June 30, 2022
Filing Date:
December 09, 2021
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B9/00; B32B9/04; B32B27/06; B65D65/40
Domestic Patent References:
WO2021176948A12021-09-10
WO2020262006A12020-12-30
Foreign References:
JP2012096551A2012-05-24
JP2000025145A2000-01-25
JP2020100024A2020-07-02
JP2018171796A2018-11-08
JP2019166779A2019-10-03
JP2014144534A2014-08-14
JP2012076288A2012-04-19
JP2000006304A2000-01-11
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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