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Patent Searching and Data


Title:
GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/103946
Kind Code:
A1
Abstract:
In this gas-blowing-hole array structure, which makes it possible to blow a gas at the entire surface of an object being conveyed, such as a printed circuit board or a semiconductor wafer, in concentric shapes that are substantially circular, and also makes it possible to heat or cool the entire surface of said object more evenly, in a nozzle cover (3), as shown in figure 1, one pattern (P1) of nozzles (2) and another pattern (P2) of nozzles (2) that exhibits line symmetry with respect thereto are provided in top and bottom regions, respectively, on one side of a central area that is in the center of the nozzle cover (3) in a direction perpendicular to a conveyance direction. Said patterns (P1 and P2) of nozzles (2) are also provided in bottom and top regions, respectively, on the other side of the nozzle cover (3) such that diagonally opposite layout patterns in the nozzle cover (3) are identical.

Inventors:
HIYAMA TSUTOMU (JP)
Application Number:
PCT/JP2013/084296
Publication Date:
July 03, 2014
Filing Date:
December 20, 2013
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
H05K3/34; B23K1/008; B23K3/04; B23K101/40; B23K101/42
Domestic Patent References:
WO2011135737A12011-11-03
WO2011036948A12011-03-31
Foreign References:
JP2007266100A2007-10-11
JP2002331357A2002-11-19
JPH037927A1991-01-16
JP2004214535A2004-07-29
Other References:
See also references of EP 2941103A4
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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