GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE

Title:

GAS-INTAKE-HOLE ARRAY STRUCTURE AND SOLDERING DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/103945

Kind Code:

A1

Abstract:

In this gas-intake-hole array structure, which makes it possible to reduce temperature fluctuations that occur while a printed circuit board, semiconductor wafer, or the like is being conveyed and also makes it possible to heat and cool a printed circuit board or the like more evenly, in a nozzle layout region of a nozzle cover (3), as shown in figure 1, one nozzle pattern (P1) and another nozzle pattern (P2) that exhibits line symmetry with respect thereto are provided in top and bottom regions, respectively, on one side of a central area that is in the center of the nozzle layout region in a direction perpendicular to a conveyance direction. Said nozzle patterns (P1 and P2) are also provided in bottom and top regions, respectively, on the other side of the central area such that diagonally opposite layout patterns in the nozzle layout region are identical. Intake ports (3b, 3c, 3d) that have prescribed widths and serve to circulate a gas blown from nozzles (2) are laid out so as to form a first row and a plurality of other rows having different phases, each of said intake ports being interposed between two or more nozzles (2). The widths of the intake ports (3b, 3c, 3d) are set so as to decrease gradually with increasing distance from the central area.

Inventors:

HIYAMA TSUTOMU (JP)

Application Number:

PCT/JP2013/084295

Publication Date:

July 03, 2014

Filing Date:

December 20, 2013

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

H05K3/34; B23K1/008; B23K3/04; B23K101/40; B23K101/42

Domestic Patent References:

WO2011135737A1	2011-11-03
WO2011036948A1	2011-03-31

Foreign References:

JP2007266100A	2007-10-11
JP2002331357A	2002-11-19
JPH037927A	1991-01-16
JP2004214535A	2004-07-29

Other References: