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Title:
GLASS-CERAMIC (LTCC) CAPABLE OF BEING ASSEMBLED WITH SILICON BY ANODIC BONDING
Document Type and Number:
WIPO Patent Application WO2005042426
Kind Code:
A3
Abstract:
The invention concerns glass-ceramic (LTCC) capable of being assembled with silicon by anodic bonding, and its use for assembling same with silicon by anodic bonding. The invention aims at providing an anodic bonding at 400 DEG C of a silicon wafer to form a large surface flat silicon-LTCC assembly. Therefor, a glass-ceramic (LTCC) is used consisting of AI2O3 8, borosilicate glass, silica glass and/or cordierite, said glass-ceramic being characterized in that: the borosilicate glass has an Na content of the order of 2.6 wt. % and a coefficient of thermal expansion alpha of the order of 3.4 ppm/K; the starting glass-ceramic composition contains 60-70 wt. % of borosilicate glass, 10-20 wt. % of AI2O3, 8-25 wt. % of cordierite and/or silica glass, such that the Na content, relative to the total weight of the material, is not more than 1.5 wt. %; said starting composition is shaped and sintered by a conventional ceramic process and exhibits a coefficient of thermal expansion alpha of the order of 3.50 3.65 ppm/K and a dielectric constant of 5 6. Said glass-ceramic can be used for producing microelectronic circuit.

Inventors:
EHRT ROLAND (DE)
ROTHE PETER (DE)
SEIFERT DIETER (DE)
VOELGER KARL WOLFGANG (DE)
Application Number:
PCT/DE2004/002414
Publication Date:
June 09, 2005
Filing Date:
October 28, 2004
Export Citation:
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Assignee:
INOCERMIC GES FUER INNOVATIVE (DE)
EHRT ROLAND (DE)
ROTHE PETER (DE)
SEIFERT DIETER (DE)
VOELGER KARL WOLFGANG (DE)
International Classes:
C03C8/14; C03C14/00; H01L21/48; H01L23/15; H01L21/58; (IPC1-7): C03C8/14; C03C14/00; H01L21/48; H01L23/15
Foreign References:
EP0575813A21993-12-29
US5283210A1994-02-01
US5316985A1994-05-31
US5342674A1994-08-30
EP0621245A11994-10-26
EP0480468A11992-04-15
US5324370A1994-06-28
Other References:
PATENT ABSTRACTS OF JAPAN vol. 017, no. 001 (C - 1014) 5 January 1993 (1993-01-05)
PATENT ABSTRACTS OF JAPAN vol. 015, no. 211 (C - 0836) 29 May 1991 (1991-05-29)
PATENT ABSTRACTS OF JAPAN vol. 017, no. 431 (E - 1411) 10 August 1993 (1993-08-10)
PATENT ABSTRACTS OF JAPAN vol. 017, no. 001 (C - 1014) 5 January 1993 (1993-01-05)
DATABASE WPI Section Ch Week 200429, Derwent World Patents Index; Class L02, AN 2004-312201, XP002323716
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 08 29 September 1995 (1995-09-29)
PATENT ABSTRACTS OF JAPAN vol. 007, no. 273 (C - 198) 6 December 1983 (1983-12-06)
DATABASE WPI Section Ch Week 198819, Derwent World Patents Index; Class L03, AN 1988-130584, XP002323717
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