Title:
METHOD OF FORMING MICROSTRUCTURES ON A SUBSTRATE AND A MICROSTRUCTURED ASSEMBLY USED FOR SAME
Document Type and Number:
WIPO Patent Application WO2005042427
Kind Code:
A3
Abstract:
A method of forming microstructures on a substrate is disclosed. A microstructured assembly that may be used in the method for forming microstructures on a substrate is also disclosed. The methods and assemblies of the present disclosure can reduce the amount of air entrapped in barrier ribs formed on substrates used in Plasma Display devices.
Inventors:
YOKOYAMA CHIKAFUMI
SUGIMOTO TAKAKI
SUGIMOTO TAKAKI
Application Number:
PCT/US2004/033170
Publication Date:
July 07, 2005
Filing Date:
October 08, 2004
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
B32B17/06; C03C17/00; H01J9/24; (IPC1-7): H01J9/24; C03C17/00
Domestic Patent References:
| WO2001020636A1 | 2001-03-22 |
Foreign References:
| US20030098528A1 | 2003-05-29 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 08 6 October 2000 (2000-10-06)
DATABASE WPI Section Ch Week 200241, Derwent World Patents Index; Class L03, AN 2002-377190, XP002326562
DATABASE WPI Section Ch Week 200241, Derwent World Patents Index; Class L03, AN 2002-377190, XP002326562
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