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Patent Searching and Data


Title:
GRAIN-ORIENTED ELECTRICAL STEEL SHEET AND METHOD FOR FORMING INSULATING FILM
Document Type and Number:
WIPO Patent Application WO/2022/215710
Kind Code:
A1
Abstract:
This grain-oriented electrical steel sheet has a base steel sheet, and an insulating film formed on a surface of the base steel sheet. The insulating film has: an intermediate layer that is formed on the base steel sheet side and that contains a crystalline metal phosphate; and a tensile film layer formed on the surface side of the insulating film. An etch pit structure is formed on the surface of the base steel sheet. The average thickness of the intermediate layer is 0.2-10.0 μm, and the average thickness of the insulating film is 2.0-10.0 μm. The tensile film layer contains a metal phosphate and silica. The contained amount of the silica in the tensile film layer is 20-60 mass%.

Inventors:
TAKEDA KAZUTOSHI (JP)
KATAOKA TAKASHI (JP)
TAKATANI SHINSUKE (JP)
KOGAKURA YUUKI (JP)
KUNITA YUKI (JP)
Application Number:
PCT/JP2022/017197
Publication Date:
October 13, 2022
Filing Date:
April 06, 2022
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C21D8/12; C21D9/46; C22C38/00; C22C38/60; C23C22/00; H01F1/147
Foreign References:
JPH05279747A1993-10-26
JP2005139481A2005-06-02
JP2020111814A2020-07-27
JPH11181576A1999-07-06
JPH07207453A1995-08-08
JP2021064968A2021-04-22
JPS4839338A1973-06-09
JPS4996920A1974-09-13
JPH06184762A1994-07-05
JPH11209891A1999-08-03
JPH05279747A1993-10-26
JP2020111814A2020-07-27
JP2018062682A2018-04-19
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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