Title:
GRANULAR CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/033031
Kind Code:
A1
Abstract:
[Problem] To provide a curable silicone composition which is a composition that can contain large amounts of a functional inorganic filler, that exhibits an excellent hot meltability characterized by a high fluidity at high temperatures, an excellent gap-filling performance, and an excellent uniformity, and that yields a cured product, wherein this curable silicone composition can be favorably used in processes from sealing to molding, e.g., transfer molding, is resistant to dust generation, and exhibits an excellent handling workability; also, to provide a production method that exhibits an excellent production efficiency for and homogeneity of said composition. [Solution] The solution is a granular curable silicone composition and applications thereof, wherein the granular curable silicone composition comprises an organopolysiloxane resin (A) that contains at least 20 mol% or more T units, a curing agent (B), and a functional inorganic filler (C), with the component (C) content being 400-3,000 mass parts per 100 mass parts of the total of component (A) and component (B). This granular curable silicone composition is a solid at 25°C; has a melt viscosity, as measured with a flow tester at 180°C, of not more than 200 Pa·s; and has an average particle diameter in the range from 0.1-10.0 mm.
Inventors:
YAMAZAKI RYOSUKE (JP)
MATSUSHIMA HIDENORI (JP)
OZAKI KOICHI (JP)
IMAIZUMI TORU (JP)
MATSUSHIMA HIDENORI (JP)
OZAKI KOICHI (JP)
IMAIZUMI TORU (JP)
Application Number:
PCT/JP2022/032737
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/04; C08J3/20; C08J5/00; C08K3/00; H01L23/29; H01L23/31
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