Title:
GRANULATING DEVICE DIE, GRANULATING DEVICE CUTTER BLADE HOLDER, GRANULATING DEVICE CUTTER BLADE UNIT, RESIN-CUTTING DEVICE, GRANULATING DEVICE, AND RESIN PELLET MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/168359
Kind Code:
A1
Abstract:
Provided are a granulating device die, a granulating device cutter blade holder, a granulating device cutter blade unit, a resin-cutting device, and a granulating device, and for the foregoing, an increase in size is suppressed even if the processing capacity is increased. A die (10) comprises: a bottom surface (10B); an upper surface (10A) having a smaller radius than the bottom surface (10B); a side surface (10C) connecting the outermost peripheral section of the bottom surface (10B) and the outermost peripheral section of the upper surface (10A); and a plurality of die holes (11) that are formed in the side surface (10C) and are for discharging a resin raw material.
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Inventors:
SEO MITSUHIRO (JP)
KURIHARA MASAO (JP)
KURIHARA MASAO (JP)
Application Number:
PCT/JP2021/033828
Publication Date:
August 11, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
JAPAN STEEL WORKS LTD (JP)
International Classes:
B29B9/06
Domestic Patent References:
| WO2004080678A1 | 2004-09-23 |
Foreign References:
| JP2010000740A | 2010-01-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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