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Title:
GRINDING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/229009
Kind Code:
A1
Abstract:
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate.　One aspect of the present disclosure pertains to a grinding liquid composition that contains silica particles and an aqueous medium. The silica particles exhibits an ignition loss of 4% or less on a dry weight basis. The silica particles has a D90 of 140-600 nm when D90 represents the particle diameter at which a cumulative frequency of 90% is achieved from the small particle diameter side in a particle size distribution based on weight determined through a centrifugal precipitation method.

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Inventors:
SAKAMOTO SHUNSUKE
Application Number:
PCT/JP2023/019507
Publication Date:
November 30, 2023
Filing Date:
May 25, 2023
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
B24B1/00; B24B37/00; C09G1/02; C09K3/14; G11B5/84
Foreign References:
JP2021175774A2021-11-04
JP2002309236A2002-10-23
JP2006097014A2006-04-13
JP2018081733A2018-05-24
JP2019178302A2019-10-17
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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